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C3 ChipZentronix
LTN20069

Wakefield-Vette

LTN20069

Heat Sinks

RoHS: Compliant

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Priced by quantity and lead time.

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Verified sourcing

RoHS

Compliant

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Technical team support

Specifications

Material
Aluminum
Tip
Board Level
Uzunluk
0.650 16.51mm
Kurşunsuz
Lead Free
Parça Durumu
Active
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Seri
Penguin
Montaj
Adhesive
Shape
Square, Fins
Kılıf / Paket
BGA
Attachment Method
Thermal Tape, Adhesive (Included)
Yükseklik
8.89mm
Thermal Resistance Forced Air Flow
8.00°C/W @ 500 LFM
Genişlik
0.653 16.59mm
Ambalaj
Box
Fabrika Tedarik Süresi
12 Weeks
Material Finish
Black Anodized
Height Off Base Height Of Fin
0.350 8.89mm
Nem Hassasiyeti (MSL)
1 (Unlimited)
RoHS Durumu
ROHS3 Compliant
Yayın Yılı
2007

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