TE0813-01-2AE11-A

Specifications

Paket

Box

Descriptionfunction

MPSoC Module

Maks. Çalışma Sıcaklığı

+ 85 C

Ürün Durumu

Active

Ram Size

2GB

Flash

128 MB

Connector Type

Board-to-Board (BTB) Socket

Boyut / Ölçü

2.050 L x 2.990 W (52.00mm x 76.00mm)

Core Processor

Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E

Fabrika Paket Adedi

1

Moduleboard Type

FPGA Core

Dimensions

52 mm x 76 mm

Flash Size

128MB

Minimum Operating Temperature

0 C

Processor Series

Zynq UltraScale+

Processor Type

XCZU2CG-1SFVC784E

Çalışma Sıcaklığı

0°C ~ 85°C

Memory Types

DDR4

Processor Brand

Xilinx

Memory Size

2 GB

Operating Supply Voltage

3.3 V, 5 V