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C3 ChipZentronix

Trenz Electronic

TE0808-05-BBE21-AZ

Embedded ICs Modules

RoHS: Compliant

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Compliant

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Specifications

Moduleboard Type
FPGA Core
Core Processor
Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Boyut / Ölçü
2.050 L x 2.990 W (52.00mm x 76.00mm)
Connector Type
Board-to-Board (BTB) Socket
Ram Size
2GB
Ürün Durumu
Active
Paket
Box
Çalışma Sıcaklığı
0°C ~ 85°C
Flash Size
128MB

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