TE0741-04-D2I-1-A

Specifications

Moduleboard Type

FPGA Core

Boyut / Ölçü

1.970 L x 1.570 W (50.00mm x 40.00mm)

Fabrika Paket Adedi

1

Core Processor

Xilinx Kintex-7 FPGA XC7K325T-2FBG676I

Connector Type

Board-to-Board (BTB) Socket

Flash

32 MB

Frekans

25 MHz

Paket

Box

Descriptionfunction

FPGA Module

Maks. Çalışma Sıcaklığı

+ 85 C

Ürün Durumu

Active

Battery Backup Switching

No Backup Battery

Operating Supply Voltage

3.3 V, 5 V

Interface Type

QSPI

Processor Brand

Xilinx

Processor Series

Kintex-7

Processor Type

XC7K325T-2FBG676I

Çalışma Sıcaklığı

-40°C ~ 85°C

Dimensions

50 mm x 40 mm

Flash Size

32MB

Minimum Operating Temperature

- 40 C