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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Height
- 31.75
- Number Of Chip Per Module
- 16
- Maximum Operating Supply Voltage V
- 2.7
- Module Sides
- Double
- Chip Package Type
- FBGA
- Lead Shape
- No Lead
- Pin Sayısı
- 200
- Chip Density Bit
- 512M
- Data Bus Width Bit
- 64
- Module Type
- 200USODIMM
- Module Density
- 1Gbyte
- Maximum Clock Rate Mhz
- 400
- Eccn Us
- EAR99
- Ecc Support
- No
- Chip Configuration
- 64Mx8
- Ppap
- Unknown
- Self Refresh
- Yes
- Eu Rohs
- Compliant
- Parça Durumu
- Obsolete
- Package Length
- 67.6
- Typical Operating Supply Voltage V
- 2.6
- Organization
- 128Mx64
- Module
- DRAM Module
- Pll
- No
- Mounting
- Socket
- Pcb Changed
- 200
- Supplier Package
- USODIMM
- Cas Latency
- 3
- Automotive
- Unknown
- Spd Eeprom Support
- Yes
- Minimum Operating Supply Voltage V
- 2.5
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