THGBM3G4D1FBAIG

Specifications

Operating Temperaturemax

85 °C

Supply Voltagenom Vsup

3.3 V

Terminal Pozisyonu

BOTTOM

Pin Sayısı

153

Memory Ic Type

MEMORY CIRCUIT

Package Body Material

PLASTIC/EPOXY

Terminal Formu

BALL

Operating Mode

SYNCHRONOUS

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Memory Width

8

Package Code

TFBGA

Terminal Adımı

0.5 mm

Seated Heightmax

1.2 mm

Ihs Manufacturer

TOSHIBA CORP

Fonksiyon Sayısı

1

Part Package Code

BGA

ECCN Kodu

EAR99

Supply Voltagemin Vsup

2.7 V

Package Shape

RECTANGULAR

HTS Kodu

8542.32.00.71

Uzunluk

13 mm

Temperature Grade

OTHER

Rohs Code

Yes

Memory Density

17179869184 bit

Organization

2GX8

Part Life Cycle Code

Obsolete

Yüzey Montaj

YES

Operating Temperaturemin

-25 °C

Supply Voltagemax Vsup

3.6 V

Package Description

TFBGA,

Number Of Terminals

153

REACH Uyumluluk Kodu

unknown

Number Of Words Code

2000000000

Number Of Words

2147483648 words

Genişlik

11.5 mm

Jesd30 Code

R-PBGA-B153