TH50VSF3581AASB

Specifications

Ihs Manufacturer

TOSHIBA CORP

Number Of Words

2097152 words

Temperature Grade

OTHER

Operating Temperaturemin

-30 °C

Seated Heightmax

1.4 mm

Package Shape

RECTANGULAR

Operating Mode

ASYNCHRONOUS

JESD-609 Kodu

e0

Supply Voltagemax Vsup

3.3 V

Memory Ic Type

MEMORY CIRCUIT

Package Description

LFBGA, BGA69,10X12,32

Qualification Status

Not Qualified

Memory Density

33554432 bit

Supply Voltagenom Vsup

3 V

Terminal Adımı

0.8 mm

Access Timemax

90 ns

Mixed Memory Type

FLASH+SRAM

Pin Sayısı

69

Fonksiyon Sayısı

1

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Part Package Code

BGA

Package Body Material

PLASTIC/EPOXY

Supply Voltagemin Vsup

2.67 V

Memory Width

16

Jesd30 Code

R-PBGA-B69

Package Code

LFBGA

ECCN Kodu

EAR99

Yüzey Montaj

YES

Package Equivalence Code

BGA69,10X12,32

Terminal Formu

BALL

Organization

2MX16

Number Of Terminals

69

Terminal Kaplaması

TIN LEAD

Supply Currentmax

0.05 mA

Part Life Cycle Code

Transferred

Terminal Pozisyonu

BOTTOM

REACH Uyumluluk Kodu

unknown

Additional Feature

USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 512K X 16 OR 1M X 8

Genişlik

9 mm

Uzunluk

12 mm