TH50VSF3580AASB

Specifications

Terminal Formu

BALL

Organization

2MX16

Number Of Terminals

69

Package Equivalence Code

BGA69,10X12,32

Supply Voltagemin Vsup

2.67 V

Memory Width

16

Yüzey Montaj

YES

ECCN Kodu

EAR99

Package Code

LFBGA

Jesd30 Code

R-PBGA-B69

Part Package Code

BGA

Package Body Material

PLASTIC/EPOXY

Genişlik

9 mm

Operating Temperaturemax

85 °C

HTS Kodu

8542.32.00.71

Uzunluk

12 mm

Number Of Words Code

2000000

REACH Uyumluluk Kodu

unknown

Additional Feature

USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 512K X 16 OR 1M X 8

Supply Currentmax

0.05 mA

Part Life Cycle Code

Transferred

Terminal Pozisyonu

BOTTOM

Terminal Kaplaması

TIN LEAD

Supply Voltagemax Vsup

3.3 V

Memory Ic Type

MEMORY CIRCUIT

Package Description

LFBGA, BGA69,10X12,32

Operating Mode

ASYNCHRONOUS

Package Shape

RECTANGULAR

JESD-609 Kodu

e0

Number Of Words

2097152 words

Temperature Grade

OTHER

Operating Temperaturemin

-30 °C

Seated Heightmax

1.4 mm

Ihs Manufacturer

TOSHIBA CORP

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Mixed Memory Type

FLASH+SRAM

Pin Sayısı

69

Fonksiyon Sayısı

1

Supply Voltagenom Vsup

3 V

Memory Density

33554432 bit