TH50VSF2580AASB

Specifications

Ihs Manufacturer

TOSHIBA CORP

Operating Temperaturemin

-40 °C

Temperature Grade

INDUSTRIAL

Number Of Words

2097152 words

Seated Heightmax

1.4 mm

Operating Mode

ASYNCHRONOUS

Package Shape

RECTANGULAR

JESD-609 Kodu

e0

Package Description

LFBGA, BGA69,10X12,32

Memory Ic Type

MEMORY CIRCUIT

Supply Voltagemax Vsup

3.6 V

Qualification Status

Not Qualified

Access Timemax

90 ns

Memory Density

33554432 bit

Supply Voltagenom Vsup

3 V

Terminal Adımı

0.8 mm

Pin Sayısı

69

Fonksiyon Sayısı

1

Mixed Memory Type

FLASH+SRAM

Rohs Code

No

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Part Package Code

BGA

Package Body Material

PLASTIC/EPOXY

Memory Width

16

Yüzey Montaj

YES

ECCN Kodu

EAR99

Package Code

LFBGA

Jesd30 Code

R-PBGA-B69

Supply Voltagemin Vsup

2.7 V

Package Equivalence Code

BGA69,10X12,32

Number Of Terminals

69

Terminal Formu

BALL

Organization

2MX16

Terminal Kaplaması

TIN LEAD

Kurşunsuz Kodu

No

Terminal Pozisyonu

BOTTOM

Supply Currentmax

0.05 mA

Part Life Cycle Code

Transferred

Additional Feature

USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 256 X 16 OR 512K X 8

REACH Uyumluluk Kodu

unknown