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Toshiba America Electronic Components

TH50VSF1421ACXB

Specialized Modules

RoHS: Compliant

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Compliant

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Specifications

Number Of Terminals
48
Terminal Formu
BALL
Package Equivalence Code
BGA48,6X8,40
Jesd30 Code
R-PBGA-B48
Package Code
BGA
ECCN Kodu
EAR99
Yüzey Montaj
YES
Package Body Material
PLASTIC/EPOXY
Operating Temperaturemax
85 °C
HTS Kodu
8542.32.00.71
REACH Uyumluluk Kodu
unknown
Terminal Pozisyonu
BOTTOM
Supply Currentmax
0.04 mA
Part Life Cycle Code
Transferred
Terminal Kaplaması
Tin/Lead (Sn/Pb)
Package Description
BGA, BGA48,6X8,40
Memory Ic Type
MEMORY CIRCUIT
Package Shape
RECTANGULAR
JESD-609 Kodu
e0
Standby Currentmax
0.00003 A
Operating Temperaturemin
-20 °C
Temperature Grade
OTHER
Ihs Manufacturer
TOSHIBA CORP
Rohs Code
No
Package Style
GRID ARRAY
Mixed Memory Type
FLASH+SRAM
Access Timemax
100 ns
Terminal Adımı
1 mm
Qualification Status
Not Qualified

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