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C3 ChipZentronix

t-Global Technology

XL25-50-50-10-T1-0.25

Heat Sinks

RoHS: Compliant

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Same-day dispatch from stock

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Verified sourcing

RoHS

Compliant

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Technical team support

Specifications

Tip
Heat Spreader
Genişlik
1.969 (50.00mm)
Ürün Durumu
Obsolete
Material
Ceramic
Seri
XL-25
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Paket
Tray
Attachment Method
Thermal Tape, Adhesive (Included)
Shape
Square
Uzunluk
1.969 (50.00mm)

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