Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Terminal Pozisyonu
- BOTTOM
- Additional Feature
- ALSO REQUIRES 3.3V SUPPLY
- Electrical Mounting
- SMT
- Uzunluk
- 23 mm
- Contacts Pitch
- 2.54mm
- Package Code
- HFBGA
- Part Package Code
- BGA
- Profile
- beryllium copper
- REACH Uyumluluk Kodu
- unknown
- Çalışma Sıcaklığı
- -40...163°C
- Package Style
- GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
- Terminal Adımı
- 0.8 mm
- Connector
- socket
- Address Bus Width
- 23
- Qualification Status
- Not Qualified
- Rated Voltage
- 60V
- Terminal Formu
- BALL
- Boundary Scan
- YES
- Row Pitch
- 2.54mm
- Pin Sayısı
- 532
- Gross Weight
- 0.48 g
- Barrel Shifter
- NO
- Package Body Material
- PLASTIC/EPOXY
- Format
- FIXED POINT
- Pin Sayısı
- 10
- Jesd30 Code
- S-PBGA-B532
- HTS Kodu
- 8542.31.00.01
- Internal Bus Architecture
- MULTIPLE
- Type Of Connector
- pin strips
- Supply Voltagenom
- 1.25 V
- Upsucsperipheral Ics Type
- DIGITAL SIGNAL PROCESSOR, OTHER
- Clock Frequencymax
- 75.75 MHz
- Spatial Orientation
- straight
- Seated Heightmax
- 3.3 mm
- Genişlik
- 23 mm
- Package Shape
- SQUARE
- External Data Bus Width
- 64
- Supply Voltagemax
- 1.31 V
- Plating Thickness
- 0.254µm
- Low Power Mode
- YES
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