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Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Genişlik
- 23 mm
- Seated Heightmax
- 3.3 mm
- REACH Uyumluluk Kodu
- unknown
- Part Package Code
- BGA
- Address Bus Width
- 23
- External Data Bus Width
- 64
- Package Shape
- SQUARE
- Terminal Adımı
- 0.8 mm
- Package Style
- GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
- Format
- FIXED POINT
- Additional Feature
- ALSO REQUIRES 3.3V SUPPLY
- Jesd30 Code
- S-PBGA-B532
- Uzunluk
- 23 mm
- HTS Kodu
- 8542.31.00.01
- Terminal Pozisyonu
- BOTTOM
- Clock Frequencymax
- 75.75 MHz
- Upsucsperipheral Ics Type
- DIGITAL SIGNAL PROCESSOR, OTHER
- Package Code
- HFBGA
- Internal Bus Architecture
- MULTIPLE
- Supply Voltagenom
- 1.4 V
- Yüzey Montaj
- YES
- Part Life Cycle Code
- Obsolete
- Pin Sayısı
- 532
- Supply Voltagemin
- 1.36 V
- Package Body Material
- PLASTIC/EPOXY
- Package Description
- HFBGA,
- Barrel Shifter
- NO
- Number Of Terminals
- 532
- ECCN Kodu
- 3A991.A.2
- Low Power Mode
- YES
- Boundary Scan
- YES
- Terminal Formu
- BALL
- Supply Voltagemax
- 1.44 V
- Qualification Status
- Not Qualified
- Ihs Manufacturer
- TEXAS INSTRUMENTS INC