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Texas Instruments

TDA2SXBTQABCQ1

Microprocessors

RoHS: Compliant

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Compliant

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Specifications

Package Shape
SQUARE
Package Description
FCBGA-760
REACH Uyumluluk Kodu
unknown
Package Style
GRID ARRAY, HEAT SINK/SLUG
Bit Size
32
Operating Temperaturemin
-40 °C
Ihs Manufacturer
TEXAS INSTRUMENTS INC
ECCN Kodu
3A991.A.2
Screening Level
AEC-Q100
Saturation Current
3
Package Code
HBGA
Spatial Orientation
straight
Temperature Grade
AUTOMOTIVE
Jesd30 Code
S-PBGA-B760
Seated Heightmax
2.96 mm
Yüzey Montaj
YES
Number Of Terminals
760
Flammability Rating
UL94V-0
Connector
socket
Profile
beryllium copper
Akım Değeri
1.5A
Kurşunsuz Kodu
No
Type Of Connector
pin strips
JESD-609 Kodu
e1
Low Power Mode
YES
Address Bus Width
16
Integrated Cache
NO
Upsucsperipheral Ics Type
MICROPROCESSOR, RISC
Tepe Reflow Süresi (maks. sn)
30
Gross Weight
2.95 g
Connector Pinout Layout
1x31
Supply Voltagemin
1.11 V
Uzunluk
23 mm
Supply Voltagenom
1.15 V
Plating Thickness
0.75µm
Kind Of Connector
female
Clock Frequencymax
38.4 MHz
Pin Sayısı
31
Rohs Code
Yes
Terminal Pozisyonu
BOTTOM

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