+90 533 300 32 01
C3 ChipZentronix
TDA2EGBDQCBDQ1

Texas Instruments

TDA2EGBDQCBDQ1

Embedded ICs Modules

RoHS: Compliant

Request a quote for pricing

Priced by quantity and lead time.

Shipping

Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

JESD-609 Kodu
e1
Genişlik
17 mm
Supply Voltagemax
1.2 V
Moisture Sensitivity Levels
3
Package Body Material
PLASTIC/EPOXY
Terminal Kaplaması
TIN SILVER COPPER
HTS Kodu
8542.31.00.01
Number Of Terminals
538
Yüzey Montaj
YES
Part Life Cycle Code
Active
Operating Temperaturemax
125 °C
Temperature Grade
AUTOMOTIVE
Seated Heightmax
1.298 mm
Jesd30 Code
S-PBGA-B538
Terminal Formu
BALL
Package Code
LFBGA
Terminal Adımı
0.65 mm
Terminal Pozisyonu
BOTTOM
Rohs Code
Yes
Date Of Intro
2018-08-26
Tepe Reflow Sıcaklığı (°C)
260
Ihs Manufacturer
TEXAS INSTRUMENTS INC
ECCN Kodu
5A992.C
Screening Level
AEC-Q100
Supply Voltagenom
1.15 V
Supply Voltagemin
1.11 V
Uzunluk
17 mm
REACH Uyumluluk Kodu
compliant
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
Operating Temperaturemin
-40 °C
Package Shape
SQUARE
Upsucsperipheral Ics Type
SoC
Package Description
LFBGA,
Tepe Reflow Süresi (maks. sn)
30

Related Products

  • Digi

    101-0383

    Embedded ICs Modules
  • Digi

    101-0404

    Embedded ICs Modules
  • Digi

    101-0405

    Embedded ICs Modules
  • Digi

    101-0434

    Embedded ICs Modules
  • Digi

    101-0435

    Embedded ICs Modules
  • Digi

    101-0436

    Embedded ICs Modules
  • Digi

    101-0446

    Embedded ICs Modules
  • Digi

    101-0453

    Embedded ICs Modules
  • Fast Delivery

    Same-day prep and shipping from stock

    Genuine Parts

    Sourced from authorized channels

    Datasheet

    Technical documents for each part

    Technical Support

    Help before and after the sale