LP2967ITPX-2833

Specifications

Package Code

FBGA

Jesd30 Code

S-PBGA-B8

Qualification Status

Not Qualified

Terminal Kaplaması

TIN LEAD

Yüzey Montaj

YES

Package Shape

SQUARE

Operating Temperature Tjmin

-40 °C

Packing Method

TR

Number Of Outputs

2

Package Description

FBGA, BGA8,3X3,20

HTS Kodu

8542.39.00.01

Operating Temperature Tjmax

125 °C

ECCN Kodu

EAR99

Tepe Reflow Sıcaklığı (°C)

260

Package Style

GRID ARRAY, FINE PITCH

Dropout Voltage1nom

0.24 V

Terminal Adımı

0.5 mm

JESD-609 Kodu

e0

Input Voltage Absolutemax

16 V

Package Body Material

PLASTIC/EPOXY

Moisture Sensitivity Levels

1

Output Voltage1nom

3.3 V

Adjustability

FIXED

Rohs Code

No

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Part Life Cycle Code

Obsolete

Line Regulationmax

0.0309%

Voltage Tolerancemax

3%

Tepe Reflow Süresi (maks. sn)

40

Terminal Pozisyonu

BOTTOM

Terminal Formu

BALL

Output Current1max

0.15 A

Package Equivalence Code

BGA8,3X3,20

Output Voltage2nom

2.8 V

REACH Uyumluluk Kodu

compliant

Number Of Terminals

8