BCW61B

Specifications

Depth

10+8.1 mm

Uzunluk

100000 mm

Direnç

to hydrostatic pressure - not less than 300 mbar for 60 seconds

Field Of Application

electrotechnical, lighting, photoelectric, security, automotive, and other equipment

Dc Current Gainmin Hfe

140

Transport Packaging Sizequantity

47*46*28/3

Package Description

,

Working Voltage

≤1500 V

Operating Temperaturemax

150 °C

Wall Thickness Before Shrinkage

0.48 mm

Assembly Length

2 x 200 ± 10 mm

ECCN Kodu

EAR99

Connector Type

F-M sealed assembly

Dielectric Strength

500 (50 Hz, 1 min.) V

Nominal Voltage

250 V

Exterior Housing Material

1

Purpose

for pressure equalization in sealed enclosures and protection against condensation formation

JESD-609 Kodu

e0

Shrink Temperature

100 deg. C

Yükseklik

18.1 mm

Contact Resistance

≤100 mOhm

Shrinkage Ratio

3 : 1

Installation Hole Size

Ф12.2 mm

Polaritychannel Type

PNP

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Yüzey Montaj

YES

Renk

black

Voltage Rating

≤1500 V

Shrink Diameter After

8 mm

Shrunk Diameter

1.6 mm

Operating Temperature Range

-55…+125 °C

Gross Weight

86.33

Material

polyolefin

Weight Gross

1718.33

Shrinkage Temperature

100 °C

Number Of Contacts

7

Shrink Diameter Before

25 mm

Transport Package Sizeqty

125*26*26/150

Part Life Cycle Code

Obsolete

Terminal Kaplaması

Tin/Lead (Sn/Pb)