X4-4.0-0-SP-SM

Specifications

Inner Diameter Supplied

0.173 (4.40mm)

Özellikler

Flame Retardant

Montaj Tipi

Surface Mount

Kılıf / Paket

144-LQFP Exposed Pad

Data Converters

A/D 52x12b SAR

Peripherals

Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT

Program Memory Type

FLASH

Shrink Temperature

70°C

Program Memory Size

4.063MB (4.063M x 8)

Connectivity

CANbus, Ethernet, FIFO, I²C, IrDA, MMC/SD/SDIO, SPI, UART/USART

Paket

Tray

Ram Size

768K x 8

Inside Diameter

4.4 mm

Eeprom Size

256K x 8

Fabrika Paket Adedi

200

Core Size

32-Bit Single-Core

Seri

XMC7000

Ürün Durumu

Active

Voltage Supply Vccvdd

2.7V ~ 5.5V

Inner Diameter Recovered

0.079 (2.01mm)

Storagerefrigeration Temperature

65°F ~ 95°F (18°C ~ 35°C)

Tedarikçi Cihaz Paketi

144-TEQFP (20x20)

Number Of Ios

116

Recovered Diameter

2 mm

Temel Ürün No

X4

Shrink Ratio

2:1

Shelf Life

144 Months

Tip

Tubing, Flexible

Part Aliases

EM7506-000

Material

Polyolefin (PO), Irradiated, Halogen Free

Ürün Tipi

Heat Shrink Tubing and Sleeves

RoHS

Details

Renk

Black

Çalışma Sıcaklığı

-40°C ~ 125°C (TA)

Speed

100MHz, 250MHz

Recovered Wall Thickness

0.011 (0.28mm)

Uzunluk

3.28 (1.00m)

Oscillator Type

External, Internal

Core Processor

ARM® Cortex®-M0+, ARM® Cortex®-M7

Shrinkage Ratio

2 to 1