NB31512001

Specifications

Inner Diameter Supplied

0.750 (19.05mm)

Inner Diameter Recovered

0.375 (9.53mm)

Ambalaj

Tray

Shelf Life

144 Months

Tedarikçi Cihaz Paketi

896-FBGA (31x31)

Primary Attributes

FPGA - 350K Logic Elements

Te Internal Description

RW-175-3/4-0-STK

Architecture

MCU, FPGA

Storagerefrigeration Temperature

32°F ~ 95°F (0°C ~ 35°C)

Recovered Inside Diameter Maxu2009

9.53u2009mmu2009[u2009.375u2009inu2009]

Özellikler

Abrasion Resistant, Chemical Resistant, Cut-Through Resistant, Flame Retardant, Fluid Resistant

Shrink Ratiou2009

2:1

Renk

Black

Ram Size

64KB

Number Of Ios

MCU - 208, FPGA - 250

Material

Polyvinylidene Fluoride (PVDF)

Peripherals

DMA, POR, WDT

Shrinkage Ratio

2 to 1

Expanded Inside Diameter Minu2009

19.05u2009mmu2009[u2009.75u2009inu2009]

Speed

800MHz

Temel Parça No

5ASTMD3

Seri

Arria V ST

Temel Ürün No

NB315

Te Internal

NB31512001

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Çalışma Sıcaklığı

-40°C ~ 100°C (TJ)

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Ürün Durumu

Active

Paket

Bag

Primary Product Coloru2009

Black

Shrink Temperature

175°C

Recovered Wall Thickness

0.017 (0.43mm)

Tip

Tubing, Semi Rigid

Wall Typeu2009

Single Wall

Parça Durumu

Active

Uzunluk

4.00 (1.22m)

Kılıf / Paket

896-BBGA, FCBGA