CB5085-000

Specifications

Inside Diameter Before Shrinking

19.05

Elv

Compliant

Boyut / Ölçü

0.197 L x 0.126 W (5.00mm x 3.20mm)

Seri

SiT8209

Paket

Bulk

Min. Çalışma Sıcaklığı

-55°C

Current Supply Disable Max

31mA

Özellikler

Flame Retardant

Inner Diameter Recovered

0.220 (5.59mm)

Current Supply Max

36mA

Çalışma Sıcaklığı

-20°C ~ 70°C

Product Length Mm

7620(mm)

Ambalaj

Tape & Reel (TR)

Frequency Stability

±10ppm

Diameter Inner Supplied

0.750 (19.05mm)

Uzunluk

25.0 (7.6m)

Yayın Yılı

2006

Besleme Gerilimi

2.8V

Fabrika Tedarik Süresi

22 Weeks

Ürün Durumu

Active

Output

LVCMOS, LVTTL

Montaj Tipi

Surface Mount

Temel Ürün No

CB50

Parça Durumu

Active

Maks. Oturma Yüksekliği

0.032 (0.80mm)

Tip

XO (Standard)

Shrinkage Ratio

3 to 1

Operating Temp Range

-55C TO 90C

Body Material

XLPO (Cross-Linked Polyolefin)

Shrink Wall Type

HEAVY

Nem Hassasiyeti (MSL)

1 (Unlimited)

Shrink Temperature

90°C

Product Thickness

1.52

Shrink Ratio

3:1

Kılıf / Paket

4-SMD, No Lead

Frekans

133.333333MHz

Base Resonator

MEMS

Renk

Black

For Use With

Cables

Inside Diameter After Shrinking

5.59