+90 533 300 32 01
C3 ChipZentronix

TE Connectivity

756165-000

Heat Shrink Boots

In StockRoHS: Compliant

Shipping

Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

Ürün Durumu
Active
Besleme Gerilimi
2.5V
Inside Diameter Before Shrinking
19.3/4.5
Output
LVCMOS, LVTTL
Product Thickness
1.5/1.14
Inside Diameter After Shrinking
13/2.1
Function
Enable/Disable
Maks. Oturma Yüksekliği
0.031 (0.80mm)
Paket
Strip
Renk
Black
Frekans
4 MHz
Tip
XO (Standard)
Kılıf / Paket
4-SMD, No Lead
Base Resonator
MEMS
Boyut / Ölçü
0.197 L x 0.126 W (5.00mm x 3.20mm)
Body Material
PO (Polyolefin)
Current Supply Max
33mA
Seri
SiT8208
Product Length Mm
60.2(mm)
For Use With
Cables
Operating Temp Range
-30C to 80C
Frequency Stability
±50ppm
Montaj Tipi
Surface Mount
Çalışma Sıcaklığı
-20°C ~ 70°C

Related Products

  • In Stock

    TE Connectivity

    000553-000

    Heat Shrink Boots
  • In Stock

    TE Connectivity

    002071-000

    Heat Shrink Boots
  • In Stock

    TE Connectivity Aerospace, Defense and Marine

    002A011-3-0

    Heat Shrink Boots
  • In Stock

    TE Connectivity

    005902-000

    Heat Shrink Boots
  • In Stock

    TE Connectivity

    007967-000

    Heat Shrink Boots
  • In Stock

    TE Connectivity

    013933-000

    Heat Shrink Boots
  • In Stock

    TE Connectivity

    014291-000

    Heat Shrink Boots
  • In Stock

    Raychem

    016211-000

    Heat Shrink Boots
  • Fast Delivery

    Same-day prep and shipping from stock

    Genuine Parts

    Sourced from authorized channels

    Datasheet

    Technical documents for each part

    Technical Support

    Help before and after the sale