603329-1

Specifications

Operating Temp Range

-55C to 125C

Seated Plane Height

Not Required(mm)

Inner Diameter Supplied

0.750 (19.05mm)

Shrinkage Ratio

2 to 1

Inner Diameter Recovered

0.375 (9.53mm)

Recovered Wall Thickness

0.030 (0.76mm)

Rad Hardened

No

Ambalaj

Tape and Reel

Microwave Application

NO

Wire Form

Not Required

Product Length Mm

1.6(mm)

Failure Rate

Not Required

Kılıf / Paket

0603

Product Diameter Mm

Not Required(mm)

Terminal Stili

PAD

Material

Polyolefin (PO)

Paket

Bulk

Parça Durumu

Active

Lead Diameter Nom

Not Required(mm)

Tolerance Or

10%

Tip

Tubing, Flexible

Product Height Mm

0.8(mm)

Uzunluk

4.00 (1.22m)

Construction

SMT Chip

Temel Ürün No

603329

Montaj Stili

Surface Mount

Gerilim

50VDC

Seri

VFP21

Product Depth Mm

0.8(mm)

Ürün Durumu

Active

Renk

Black

Kapasitans

4700PF(pF)

Technology

STANDARD

Case Style

Ceramic Chip

Number Of Terminals

2

Temp Coeff Dielectric

X7R

Shrink Temperature

125°C