254537

Specifications

Contact Lengthmating

0.157 (4.00mm)

Insulation Height

0.325 (8.25mm)

Contact Finish Post

Tin

Akım Değeri

1.7 A

Housing Material

Liquid Crystal Polymer (LCP)

Sıra Sayısı

2

Mounting Angle

Vertical

Row Spacing Mating

0.050 (1.27mm)

Contact Shape

Square

Pitch

1.27 mm

Number Of Positions Loaded

All

Çalışma Sıcaklığı

-55°C ~ 125°C

Özellikler

Board Guide, Pick and Place, Solder Retention

Paket

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Terminal

Solder

Contact Type

Male Pin

Contact Plating

Gold

Connector Type

Header

Maximum Data Rate

3 Gbps

Current Rating Amps

1.7A per Contact

Contact Finish Mating

Gold

Shrouding

Shrouded - 4 Wall

Pitch Mating

0.050 (1.27mm)

Seri

SMC

Ürün Durumu

Active

Contact Finish Thickness Post

157.5µin (4.00µm)

Stack Height

3.25 mm

Style

Board to Board

Contact Materials

Copper Alloy

Montaj Tipi

Surface Mount

Insulation Color

Black

Material Flammability Rating

UL94 V-0

Fastening Type

Push-Pull

Maks. Çalışma Sıcaklığı

+ 125 C

Insulation Materials

Liquid Crystal Polymer (LCP)

Terminal Stili

Solder

Minimum Operating Temperature

- 55 C

Pozisyon Sayısı

20