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C3 ChipZentronix

TE Connectivity

2355827-9

Rectangular Connectors Arrays

RoHS: Compliant

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Compliant

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Specifications

Contact Plating
Gold
Mounting Angle
Vertical
Contact Materials
Copper
Paket
Tape & Reel (TR)
Fabrika Paket Adedi
100
Pitch
1.27 mm
Height Above Board
0.551 (14.00mm)
Housing Material
Liquid Crystal Polymer (LCP)
Terminal Stili
Solder Balls
Connector Type
Array, Female Sockets
Özellikler
Pick and Place
Contact Finish Thickness
50.0µin (1.27µm)
Sıra Sayısı
8 Row
Seri
Mezalok XMC
Ürün Durumu
Active
Mated Stacking Heights
18mm
RoHS
N
Maks. Çalışma Sıcaklığı
+ 125 C
Temel Ürün No
2355827
Pozisyon Sayısı
320 Position
Contact Finish
Gold
Akım Değeri
1.5 A
Montaj Tipi
Surface Mount
Minimum Operating Temperature
- 55 C

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