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TE Connectivity

2-2822979-4

Transistor Sockets

In StockRoHS: Compliant

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RoHS

Compliant

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Specifications

Number Of Positionsu2009
3647
Termination Method
Solder Pot
Package Type
LGA
Ürün Tipi
IC & Component Sockets
Body Orientation
Straight
Product Length Mm
84(mm)
Terminal Stili
Solder Ball
Te Internal Description
LGA3647-1 SOCKET-P1 KIT FOR ODM (30U AU)
Maks. Çalışma Sıcaklığı
+ 100 C
Minimum Operating Temperature
- 25 C
Insulation Materials
Thermoplastic
Centerline Pitchu2009mm
.86, .99
Ambalaj
Tray
Schedule B
8536694040/8536694040/8536694040/8536694040/8536694040
Product Depth Mm
64(mm)
Insulation Resistance
500(Mohm)
Contact Materials
Copper Alloy
Circuit Applications
Signal
Pozisyon Sayısı
3647
Rad Hardened
No
Centerline Pitchu2009in
.034, .039
Lifecycle Status
Production (Last Updated: 3 days ago)
Housing Color
Black
Fabrika Paket Adedi
12
Operating Temp Range
-25C to 100C
Connector Systemu2009
Board-to-Board
Contact Plating
Gold Over Nickel
Contact Mating Area Plating Material Thicknessu2009in
30
Plating
Gold
Ic Socket Typeu2009
LGA 3647
Te Internal
2-2822979-4
Voltage Rating
500 VDC
RoHS
Non-Compliant
Pitch
0.85mm
Gender
SKT
Montaj
Solder, Surface Mount
Housing Material
Thermoplastic
Tip
LGA Socket
Number Of Contacts
3647(POS)
Flammability Rating
UL94 V-0

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