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C3 ChipZentronix
2-2013298-3

TE Connectivity

2-2013298-3

Inline Memory Module Sockets

RoHS: Compliant

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RoHS

Compliant

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Specifications

Sealable
No
Montaj
Surface Mount
Maks. Çalışma Sıcaklığı
185°C
Lifecycle Status
ACTIVE (Last Updated: 6 months ago)
Parça Durumu
Active
Radyasyon Dayanımı
No
Nominal Gerilim
1.5V
Yayın Yılı
2010
Insulation Materials
Thermoplastic
Orientation
Right Angle
Plating
Gold
Number Of Contacts
204
Row Spacing Mating
8.1788 mm
Pozisyon Sayısı
204
Depth
26.5mm
Contact Plating
Gold
RoHS Durumu
RoHS Compliant
Housing Color
Black
Housing Material
Thermoplastic
Pitch
609.6μm
Circuit Applications
Power
Fabrika Tedarik Süresi
10 Weeks
Plating Thickness
760 nm
Flammability Rating
UL94 V-0
Stack Height
8.001mm
Memory Types
DDR, SDRAM
Ambalaj
Tape & Reel (TR)
Contact Rating Current
500mA
Sıra Sayısı
2
Current Rating Max
500mA
Min. Çalışma Sıcaklığı
-67°C
Uzunluk
75.9mm
Terminal
Solder

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