+90 533 300 32 01
C3 ChipZentronix

TE Connectivity

216-0032

RFI & EMI Materials

In StockRoHS: Compliant

Shipping

Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

Te Internal Description
Round Sil Sponge Core SS Dia3.2 L25m
Resistance To Petroleumu2009
No
Gasket Shapeu2009
Round
Operating Temperature Rangeu2009
-50 – 200u2009°Cu2009[u2009-58 – 392u2009°Fu2009]
Device Core
e200z4
Product Lengthu2009
25u2009mu2009[u200982u2009ftu2009]
Te Internal
2423873-1
Gasket Typeu2009
Knitted Wire EMI Gasket
Data Bus Width
32 Bit
Interface
CAN/I2C/I2S/LIN/SPI
Program Memory Size
3 MB

Related Products

  • In Stock

    Laird Technologies EMI

    0077004217

    RFI & EMI Materials
  • In Stock

    Laird Technologies EMI

    0077006615

    RFI & EMI Materials
  • In Stock

    Laird Technologies EMI

    0078002317

    RFI & EMI Materials
  • In Stock

    3M (TC)

    0.52-4-AB5020

    RFI & EMI Materials
  • In Stock

    3M (TC)

    0.52-4-AB5030

    RFI & EMI Materials
  • In Stock

    3M (TC)

    0.52-4-AB5050

    RFI & EMI Materials
  • In Stock

    3M (TC)

    0.625-5-CN3190

    RFI & EMI Materials
  • In Stock

    3M (TC)

    0.625-5-CN3490

    RFI & EMI Materials
  • Fast Delivery

    Same-day prep and shipping from stock

    Genuine Parts

    Sourced from authorized channels

    Datasheet

    Technical documents for each part

    Technical Support

    Help before and after the sale