+90 533 300 32 01
C3 ChipZentronix

TE Connectivity

2013311-1

Inline Memory Module Sockets

RoHS: Compliant

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Verified sourcing

RoHS

Compliant

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Technical team support

Specifications

Gender
SKT
Grid Size
Not Required
Rad Hardened
No
Montaj Stili
Surface Mount
Product Depth Mm
26.5(mm)
Number Of Contact Rows
2
Ambalaj
Tray
Contact Plating
Gold Over Nickel
Product Height Mm
9.43(mm)
Housing Material
Thermoplastic
Contact Materials
Copper Alloy
Number Of Contacts
204(POS)
Pitch Mm
0.6(mm)
Termination Method
Solder
Insulation Materials
Thermoplastic
Body Orientation
Right Angle
Product Length Mm
75.9(mm)
Tip
DDR3 SO DIMM SOCKET

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