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C3 ChipZentronix

TE Connectivity

2013310-1

Inline Memory Module Sockets

RoHS: Compliant

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RoHS

Compliant

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Specifications

Product Height Mm
9.9(mm)
Paket
Bulk
Pozisyon Sayısı
204
Housing Material
Thermoplastic
Housing Color
Black
Manufacturer Lifecycle Status
ACTIVE (Last Updated: 6 days ago)
Row Spacing Mm
8.2(mm)
Number Of Contacts
204(POS)
Operating Temp Range
-55C to 85C
Birim Ağırlık
0.251574 oz
Grid Size
Not Required
Uzunluk
76.1 mm
Montaj Tipi
Surface Mount
RoHS
Details
Stack Height
9.1948 mm
Ürün Durumu
Active
Max Current Rating
500 mA
Min. Çalışma Sıcaklığı
-67 °C
Lifecycle Status
Production (Last Updated: 6 days ago)
Contact Plating
Gold
Pitch
0.6000 mm
Pitch Mm
0.6(mm)
Contact Materials
Copper Alloy
Elv
Compliant
Fabrika Paket Adedi
20
Contact Current Rating
500 mA
Circuit Applications
Power
Row Spacing
8.1788 mm
Terminal
Solder
Maks. Çalışma Sıcaklığı
185 °C
Flammability Rating
UL94 V-0
Memory Types
DDR, SDRAM
Voltage Rating
1.5V
Kurşunsuz
Lead Free
Body Orientation
Straight
Insulation Materials
Thermoplastic
Basehousing Material
Thermoplastic
Termination Method
Solder
Sıra Sayısı
2
Akım Değeri
0.5/Contact(A)

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