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C3 ChipZentronix

TE Connectivity

2013287-3

Inline Memory Module Sockets

RoHS: Compliant

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Specifications

Housing Material
Thermoplastic
Number Of Contacts
204
Pitch
600 µm
Stack Height
4 mm
Housing Color
Black
Insulation Materials
Thermoplastic
Depth
26 mm
Sıra Sayısı
2
Contact Plating
Gold
Uzunluk
71 mm
Pozisyon Sayısı
204
Radyasyon Dayanımı
No
Flammability Rating
UL94 V-0
Montaj
Surface Mount
Elv
Compliant
Terminal
Solder
Orientation
Right Angle
Row Spacing
8.2 mm
Memory Types
DDR, SDRAM
RoHS
Compliant

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