+90 533 300 32 01
C3 ChipZentronix

TE Connectivity

2013266-1

Inline Memory Module Sockets

RoHS: Compliant

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RoHS

Compliant

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Specifications

Ambalaj
Tray
Tip
DDR3 DIMM SOCKET
Number Of Contacts
240(POS)
Housing Material
Thermoplastic
Termination Method
Solder
Rad Hardened
No
Product Height Mm
23.1(mm)
Number Of Contact Rows
2
Contact Plating
Gold Over Nickel
Montaj Stili
Through Hole
Grid Size
Not Required
Insulation Materials
Thermoplastic
Product Depth Mm
7.54(mm)
Contact Materials
Copper Alloy
Body Orientation
Straight
Pitch Mm
2(mm)
Product Length Mm
141(mm)
Gender
SKT

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