2007797-1

Specifications

Termination Method

Solder

Montaj Stili

Through Hole

Basehousing Material

LCP (Liquid Crystal Polymer)

Product Height Mm

11.95(mm)

Seri

IMPACT Backplane

Sıra Sayısı

9

Product Depth Mm

16.7(mm)

Gender

Header

Rowtorow Spacingu2009

1.35u2009mmu2009[u2009.053u2009inu2009]

Te Internal

2007797-1

Birim Ağırlık

0.470167 oz

Mating Alignmentu2009

With

Pozisyon Sayısı

96 Position

Product Length

36.9 mm

Voltage Rating Max

30VDC/30VAC

Ürün Tipi

High Speed / Modular Connectors

Contact Materials

Copper Alloy

Operating Temp Range

-55C to 85C

Mounting

Through Hole

Number Of Contacts

144 POS

Contact Plating

Gold

Product Length Mm

36.9(mm)

Pitch Mm

1.9(mm)

Terminal Stili

Through Hole - Press Fit

Current Rating Max

0.75/Contact(A)

Connector Systemu2009

Board-to-Board

Te Internal Description

IMP100S,H,V3P16C,RG,OEW39,4.5

Mating Alignment Typeu2009

Keyed

Housing Material

Liquid Crystal Polymer (LCP)

Çalışma Sıcaklığı

-55 to 85 °C

Number Of Contact Rows

9

Body Orientation

Straight

Tip

Backplane

Pitch

1.9000 mm

Fabrika Paket Adedi

13

Number Of Positionsu2009

144