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C3 ChipZentronix

TE Connectivity

1542005-3

Heat Sinks

In StockRoHS: Compliant

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Compliant

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Specifications

Finish
Black Anodized
Body Material
Aluminum
Product Height Mm
19.05(mm)
Rad Hardened
No
Fin Style
Pin Array
Product Diameter Mm
34.95(mm)
Device Cooled
BGA
Attachment Method
Adhesive
Thermal Resistance
11.21°C/W
Tip
Passive

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