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C3 ChipZentronix

TE Connectivity

1-2057754-1

Wire-to-Board Terminal Blocks

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Specifications

Connector Systemu2009
Board-to-Board
Shell Material
Aluminum Alloy
Number Of Signal Positions
48
Flammability Rating
UL94 V-0
Rowtorow Spacingu2009
1.35u2009mmu2009[u2009.053u2009inu2009]
Housing Color
Black
Paket
Bulk
Plating Thickness
1.27 µm
Genişlik
16.7 mm
Mating Alignment Typeu2009
Guide Pin
Make First Break Last
No
Data Rate
25 Gbps
Contact Finish Mating
Gold
Terminal
Crimp
Hole Diameter
457.2 µm
Fastening Type
Bayonet Lock
Differential Signaling
Yes
Shell Finish
Olive Drab Cadmium
Yükseklik
11.95 mm
Orientation
N (Normal)
Connector Type
Receptacle, Female Sockets
Mating Alignmentu2009
With
Pcb Thickness
990.6 µm
Primary Material
Metal
Pcb Mounting Orientation
Vertical
Min. Çalışma Sıcaklığı
-67 °C
Underplate Material
Nickel
Max Current Rating
750 mA
Contact Plating
Gold, Tin
Çalışma Sıcaklığı
-55°C ~ 125°C
Current Rating Amps
13A
Mounting Feature
Flange
Shell Size Insert
20-27
Temel Ürün No
CIR03
Pozisyon Sayısı
14
Housing Material
Polymer
Number Of Positionsu2009
72
Seri
CIR
Te Internal Description
IMP100S,H,V3P8C,LG,REW46,4.5
Manufacturer Lifecycle Status
ACTIVE (Last Updated: 3 weeks ago)

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