NAND01GR3B2BZA6E

Specifications

Memory Density

1073741824 bit

Supply Voltagemax Vsup

1.95 V

Package Body Material

PLASTIC/EPOXY

Package Description

TFBGA, BGA63,10X12,32

Rohs Code

Yes

Organization

128MX8

Operating Temperaturemax

85 °C

Terminal Formu

BALL

Number Of Terminals

63

Standby Currentmax

0.00005 A

JESD-609 Kodu

e1

ECCN Kodu

3A991.B.1.A

Tip

SLC NAND TYPE

Yüzey Montaj

YES

Number Of Words Code

128000000

Command User Interface

YES

Terminal Adımı

0.8 mm

Package Shape

RECTANGULAR

Number Of Sectorssize

1K

Üretici Parça No

NAND01GR3B2BZA6E

Memory Width

8

Qualification Status

Not Qualified

Package Code

TFBGA

REACH Uyumluluk Kodu

compliant

Seated Heightmax

1.05 mm

Readybusy

YES

Access Timemax

30 ns

Uzunluk

12 mm

Supply Voltagemin Vsup

1.7 V

Programming Voltage

1.8 V

Kurşunsuz Kodu

Yes

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Part Package Code

BGA

Memory Ic Type

FLASH

Sector Size

128K

Parallelserial

PARALLEL

Ihs Manufacturer

MICRON TECHNOLOGY INC

Tepe Reflow Sıcaklığı (°C)

260

Temperature Grade

INDUSTRIAL

Pin Sayısı

63