S72NS512PE0KFFG00

Specifications

Terminal Adımı

0.65 mm

Terminal Formu

BALL

Package Code

TFBGA

Seated Heightmax

1.05 mm

Number Of Words Code

32000000

Supply Voltagemax Vsup

1.95 V

Additional Feature

DRAM IS ORGANISED AS 16M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

Organization

32MX16

Memory Width

16

Package Description

TFBGA,

Package Shape

SQUARE

ECCN Kodu

3A991.B.1.A

HTS Kodu

8542.32.00.51

Uzunluk

12 mm

Ihs Manufacturer

SPANSION INC

Rohs Code

Yes

Supply Voltagemin Vsup

1.7 V

REACH Uyumluluk Kodu

unknown

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Operating Temperaturemax

85 °C

Package Body Material

PLASTIC/EPOXY

Pin Sayısı

128

Tepe Reflow Süresi (maks. sn)

40

Genişlik

12 mm

Qualification Status

Not Qualified

Supply Voltagenom Vsup

1.8 V

Temperature Grade

OTHER

Operating Mode

ASYNCHRONOUS

Number Of Words

33554432 words

Yüzey Montaj

YES

Terminal Pozisyonu

BOTTOM

Memory Density

536870912 bit

Fonksiyon Sayısı

1

Part Package Code

BGA

Tepe Reflow Sıcaklığı (°C)

260

Part Life Cycle Code

Obsolete

Number Of Terminals

128

Operating Temperaturemin

-25 °C

Jesd30 Code

S-PBGA-B128

Memory Ic Type

MEMORY CIRCUIT