S72NS256PD0AJBLG3

Specifications

Number Of Words

16777216 words

Operating Mode

ASYNCHRONOUS

Yüzey Montaj

YES

Terminal Pozisyonu

BOTTOM

Memory Density

268435456 bit

Fonksiyon Sayısı

1

Part Package Code

BGA

Tepe Reflow Sıcaklığı (°C)

260

Moisture Sensitivity Levels

3

Part Life Cycle Code

Obsolete

Number Of Terminals

133

Operating Temperaturemin

-25 °C

Memory Ic Type

MEMORY CIRCUIT

Jesd30 Code

S-PBGA-B133

Terminal Kaplaması

TIN SILVER COPPER NICKEL

Terminal Adımı

0.5 mm

Package Code

TFBGA

Terminal Formu

BALL

Supply Voltagemax Vsup

1.95 V

Number Of Words Code

16000000

Seated Heightmax

1.1 mm

Organization

16MX16

Additional Feature

DRAM IS ORGANISED AS 16M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

Memory Width

16

ECCN Kodu

EAR99

Package Description

8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133

Package Shape

SQUARE

HTS Kodu

8542.32.00.71

Uzunluk

8 mm

Rohs Code

Yes

Ihs Manufacturer

SPANSION INC

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

REACH Uyumluluk Kodu

unknown

Supply Voltagemin Vsup

1.7 V

Pin Sayısı

133

JESD-609 Kodu

e2

Operating Temperaturemax

85 °C

Package Body Material

PLASTIC/EPOXY

Tepe Reflow Süresi (maks. sn)

40

Genişlik

8 mm