S71PL129NB0HFW4B0

Specifications

Tepe Reflow Sıcaklığı (°C)

260

Moisture Sensitivity Levels

3

Fonksiyon Sayısı

1

Part Package Code

BGA

Operating Temperaturemin

-25 °C

Memory Ic Type

MEMORY CIRCUIT

Jesd30 Code

R-PBGA-B64

Part Life Cycle Code

Obsolete

Access Timemax

70 ns

Number Of Terminals

64

Terminal Pozisyonu

BOTTOM

Number Of Words

8388608 words

Operating Mode

ASYNCHRONOUS

Yüzey Montaj

YES

Package Equivalence Code

BGA64,10X12,32

Memory Density

134217728 bit

REACH Uyumluluk Kodu

unknown

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Supply Voltagemin Vsup

2.7 V

Uzunluk

11.6 mm

Rohs Code

Yes

Ihs Manufacturer

SPANSION INC

Genişlik

8 mm

Temperature Grade

OTHER

Supply Voltagenom Vsup

3 V

Qualification Status

Not Qualified

Pin Sayısı

64

JESD-609 Kodu

e1

Package Body Material

PLASTIC/EPOXY

Operating Temperaturemax

85 °C

Tepe Reflow Süresi (maks. sn)

40

Package Code

TFBGA

Terminal Formu

BALL

Number Of Words Code

8000000

Supply Voltagemax Vsup

3.1 V

Seated Heightmax

1.2 mm

Terminal Kaplaması

TIN SILVER COPPER

Terminal Adımı

0.8 mm

Mixed Memory Type

FLASH+PSRAM

ECCN Kodu

EAR99