S71PL129JC0BFW9B0

Specifications

Pin Sayısı

64

JESD-609 Kodu

e1

Package Body Material

PLASTIC/EPOXY

Operating Temperaturemax

85 °C

Tepe Reflow Süresi (maks. sn)

40

Genişlik

8 mm

Temperature Grade

OTHER

Supply Voltagenom Vsup

3 V

Qualification Status

Not Qualified

Uzunluk

11.6 mm

Rohs Code

Yes

Ihs Manufacturer

SPANSION INC

REACH Uyumluluk Kodu

unknown

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Supply Voltagemin Vsup

2.7 V

Organization

8MX16

Additional Feature

PSEUDO STATIC RAM IS ORGANIZED AS 4M X 16

Memory Width

16

ECCN Kodu

EAR99

Package Description

8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64

Package Shape

RECTANGULAR

HTS Kodu

8542.32.00.71

Terminal Kaplaması

TIN SILVER COPPER

Terminal Adımı

0.8 mm

Package Code

TFBGA

Terminal Formu

BALL

Number Of Words Code

8000000

Supply Voltagemax Vsup

3.1 V

Seated Heightmax

1.2 mm

Part Life Cycle Code

Obsolete

Number Of Terminals

64

Operating Temperaturemin

-25 °C

Memory Ic Type

MEMORY CIRCUIT

Jesd30 Code

R-PBGA-B64

Fonksiyon Sayısı

1

Part Package Code

BGA

Tepe Reflow Sıcaklığı (°C)

260

Moisture Sensitivity Levels

3

Memory Density

134217728 bit

Number Of Words

8388608 words