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C3 ChipZentronix

Spansion

S71PL127JB0BAWQB0

Specialized Modules

RoHS: Compliant

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RoHS

Compliant

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Specifications

Number Of Words
8388608 words
Operating Temperaturemax
85 °C
Ihs Manufacturer
SPANSION INC
Part Package Code
BGA
Fonksiyon Sayısı
1
Memory Ic Type
MEMORY CIRCUIT
Operating Mode
ASYNCHRONOUS
Package Description
TFBGA,
HTS Kodu
8542.32.00.71
Memory Width
16
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
Package Body Material
PLASTIC/EPOXY
Jesd30 Code
R-PBGA-B64
Package Code
TFBGA
REACH Uyumluluk Kodu
unknown
Additional Feature
PSRAM IS ORGANIZED AS 2M X 16
Seated Heightmax
1.2 mm
Supply Voltagenom Vsup
3 V
ECCN Kodu
EAR99
Number Of Terminals
64
Number Of Words Code
8000000
Pin Sayısı
64
Terminal Pozisyonu
BOTTOM
Part Life Cycle Code
Obsolete
Qualification Status
Not Qualified
Genişlik
8 mm
Terminal Adımı
0.8 mm
Supply Voltagemin Vsup
2.7 V
Yüzey Montaj
YES
Uzunluk
11.6 mm
Temperature Grade
OTHER
Package Shape
RECTANGULAR
Organization
8MX16
Memory Density
134217728 bit
Supply Voltagemax Vsup
3.6 V
Operating Temperaturemin
-25 °C
Terminal Formu
BALL

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