S71PL127JB0BAW9Z

Specifications

Package Code

TFBGA

Jesd30 Code

R-PBGA-B64

JESD-609 Kodu

e0

Package Body Material

PLASTIC/EPOXY

HTS Kodu

8542.32.00.71

Memory Width

16

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Package Description

TFBGA,

Moisture Sensitivity Levels

3

Operating Mode

ASYNCHRONOUS

Memory Ic Type

MEMORY CIRCUIT

Fonksiyon Sayısı

1

Part Package Code

BGA

Ihs Manufacturer

SPANSION INC

Operating Temperaturemax

85 °C

Number Of Words

8388608 words

Terminal Formu

BALL

Operating Temperaturemin

-25 °C

Supply Voltagemax Vsup

3.6 V

Terminal Kaplaması

TIN LEAD

Package Shape

RECTANGULAR

Memory Density

134217728 bit

Organization

8MX16

Temperature Grade

OTHER

Uzunluk

11.6 mm

Yüzey Montaj

YES

Supply Voltagemin Vsup

2.7 V

Terminal Adımı

0.8 mm

Genişlik

8 mm

Qualification Status

Not Qualified

Part Life Cycle Code

Obsolete

Rohs Code

No

Terminal Pozisyonu

BOTTOM

Pin Sayısı

64

Number Of Words Code

8000000

Number Of Terminals

64

Supply Voltagenom Vsup

3 V

ECCN Kodu

EAR99

Seated Heightmax

1.2 mm

REACH Uyumluluk Kodu

compliant