S71JL064H80BAW110

Specifications

Package Body Material

PLASTIC/EPOXY

JESD-609 Kodu

e0

Package Equivalence Code

BGA73,10X12,32

Package Code

LFBGA

Jesd30 Code

R-PBGA-B73

Package Description

LFBGA,

HTS Kodu

8542.32.00.71

Memory Width

16

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Currentmax

0.045 mA

Mixed Memory Type

FLASH+PSRAM

Memory Ic Type

MEMORY CIRCUIT

Operating Mode

ASYNCHRONOUS

Moisture Sensitivity Levels

3

Operating Temperaturemax

85 °C

Ihs Manufacturer

SPANSION INC

Number Of Words

4194304 words

Access Timemax

70 ns

Part Package Code

BGA

Fonksiyon Sayısı

1

Temperature Grade

OTHER

Uzunluk

11.6 mm

Memory Density

67108864 bit

Organization

4MX16

Package Shape

RECTANGULAR

Terminal Formu

BALL

Operating Temperaturemin

-25 °C

Terminal Kaplaması

TIN LEAD

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Supply Voltagemax Vsup

3.3 V

Qualification Status

Not Qualified

Genişlik

8 mm

Terminal Adımı

0.8 mm

Tepe Reflow Süresi (maks. sn)

NOT SPECIFIED

Yüzey Montaj

YES

Supply Voltagemin Vsup

2.7 V

Number Of Terminals

73

Pin Sayısı

73

Number Of Words Code

4000000

Rohs Code

No