S71GL256NB0BAWAZ3

Specifications

Package Code

TFBGA

Jesd30 Code

R-PBGA-B84

JESD-609 Kodu

e0

Package Body Material

PLASTIC/EPOXY

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Memory Width

16

HTS Kodu

8542.32.00.71

Package Description

TFBGA,

Operating Mode

ASYNCHRONOUS

Memory Ic Type

MEMORY CIRCUIT

Part Package Code

BGA

Fonksiyon Sayısı

1

Ihs Manufacturer

SPANSION INC

Operating Temperaturemax

85 °C

Number Of Words

16777216 words

Terminal Formu

BALL

Operating Temperaturemin

-25 °C

Supply Voltagemax Vsup

3.1 V

Terminal Kaplaması

TIN LEAD

Package Shape

RECTANGULAR

Memory Density

268435456 bit

Organization

16MX16

Temperature Grade

OTHER

Uzunluk

11.6 mm

Yüzey Montaj

YES

Supply Voltagemin Vsup

2.7 V

Terminal Adımı

0.8 mm

Genişlik

8 mm

Qualification Status

Not Qualified

Part Life Cycle Code

Obsolete

Rohs Code

No

Terminal Pozisyonu

BOTTOM

Pin Sayısı

84

Number Of Words Code

16000000

Number Of Terminals

84

Supply Voltagenom Vsup

3 V

ECCN Kodu

EAR99

Seated Heightmax

1.2 mm

Additional Feature

PSRAM IS ORGANIZED AS 2M X 16

REACH Uyumluluk Kodu

compliant