S71GL032NA0BFW0Z0

Specifications

Moisture Sensitivity Levels

3

Memory Ic Type

MEMORY CIRCUIT

Operating Mode

ASYNCHRONOUS

Part Package Code

BGA

Fonksiyon Sayısı

1

Number Of Words

2097152 words

Operating Temperaturemax

85 °C

Ihs Manufacturer

SPANSION INC

Jesd30 Code

R-PBGA-B56

Package Code

TFBGA

JESD-609 Kodu

e1

Package Body Material

PLASTIC/EPOXY

HTS Kodu

8542.32.00.71

Memory Width

16

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Package Description

7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

Part Life Cycle Code

Obsolete

Terminal Pozisyonu

BOTTOM

Rohs Code

Yes

Number Of Words Code

2000000

Pin Sayısı

56

Number Of Terminals

56

ECCN Kodu

EAR99

Supply Voltagenom Vsup

3 V

Additional Feature

PSRAM IS ORGANIZED AS 1M X 16

REACH Uyumluluk Kodu

unknown

Seated Heightmax

1.2 mm

Terminal Kaplaması

TIN SILVER COPPER

Tepe Reflow Sıcaklığı (°C)

260

Supply Voltagemax Vsup

3.1 V

Operating Temperaturemin

-25 °C

Terminal Formu

BALL

Organization

2MX16

Memory Density

33554432 bit

Package Shape

RECTANGULAR

Uzunluk

9 mm

Temperature Grade

OTHER

Supply Voltagemin Vsup

2.7 V

Yüzey Montaj

YES

Tepe Reflow Süresi (maks. sn)

40