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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Style
- GRID ARRAY, VERY THIN PROFILE, FINE PITCH
- Number Of Sectorssize
- 16,254
- Uzunluk
- 11 mm
- Moisture Sensitivity Levels
- 3
- Number Of Words
- 8388608 words
- Operating Temperaturemax
- 85 °C
- Organization
- 8MX16
- Temperature Grade
- INDUSTRIAL
- Sector Size
- 4K,32K
- Operating Mode
- SYNCHRONOUS
- Terminal Kaplaması
- TIN SILVER COPPER
- Yüzey Montaj
- YES
- REACH Uyumluluk Kodu
- unknown
- Supply Voltagemax Vsup
- 3.6 V
- Jesd30 Code
- R-PBGA-B80
- Additional Feature
- TOP AND BOTTOM BOOT BLOCK
- Part Life Cycle Code
- Transferred
- Package Description
- 8 X 11 MM, LEAD FREE, FBGA-80
- HTS Kodu
- 8542.32.00.51
- Tepe Reflow Sıcaklığı (°C)
- 260
- Genişlik
- 8 mm
- Readybusy
- YES
- Ihs Manufacturer
- SPANSION INC
- Supply Voltagemin Vsup
- 2.7 V
- Memory Ic Type
- FLASH
- Rohs Code
- Yes
- Tip
- NOR TYPE
- Number Of Terminals
- 80
- Boot Block
- BOTTOM/TOP
- Operating Temperaturemin
- -40 °C
- Toggle Bit
- YES
- Supply Voltagenom Vsup
- 3 V
- Page Size
- 8 words
- JESD-609 Kodu
- e1
- Tepe Reflow Süresi (maks. sn)
- 40
- Memory Width
- 16
- Package Code
- VFBGA
- ECCN Kodu
- EAR99
- Package Shape
- RECTANGULAR
- Fonksiyon Sayısı
- 1
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