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C3 ChipZentronix

Spansion

S29GL064M11BFIR0

Memory Modules

RoHS: Compliant

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RoHS

Compliant

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Specifications

Toggle Bit
YES
Data Polling
YES
Terminal Formu
BALL
Package Body Material
PLASTIC/EPOXY
Package Code
FBGA
Readybusy
YES
Supply Voltagemin Vsup
3 V
Package Shape
RECTANGULAR
Parallelserial
PARALLEL
Package Equivalence Code
BGA63,8X12,32
Qualification Status
Not Qualified
Number Of Terminals
63
Package Description
FBGA, BGA63,8X12,32
Organization
8MX8
Operating Temperaturemin
-40 °C
Number Of Words Code
8000000
Jesd30 Code
R-PBGA-B63
Number Of Sectorssize
128
Access Timemax
110 ns
Boot Block
BOTTOM/TOP
Memory Ic Type
FLASH
Supply Voltagenom Vsup
3.3 V
Sector Size
64K
Operating Temperaturemax
85 °C
Terminal Pozisyonu
BOTTOM
Common Flash Interface
YES
Package Style
GRID ARRAY, FINE PITCH
Operating Mode
ASYNCHRONOUS
Tip
NOR TYPE
Terminal Adımı
0.8 mm
Command User Interface
YES
Standby Currentmax
0.000005 A
Memory Width
8
Fonksiyon Sayısı
1
Ihs Manufacturer
SPANSION INC
ECCN Kodu
EAR99
Supply Currentmax
0.06 mA
Page Size
8 words
Temperature Grade
INDUSTRIAL
Tepe Reflow Süresi (maks. sn)
40

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