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C3 ChipZentronix

SK Hynix Inc

HY64UD16322A-DF70E

Specialized Modules

RoHS: Compliant

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RoHS

Compliant

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Specifications

Package Code
FBGA
Terminal Adımı
0.75 mm
Terminal Formu
BALL
Output Characteristics
3-STATE
Terminal Pozisyonu
BOTTOM
Qualification Status
Not Qualified
Number Of Words
2097152 words
Io Type
COMMON
Access Timemax
70 ns
Ihs Manufacturer
SK HYNIX INC
ECCN Kodu
EAR99
Number Of Words Code
2000000
Operating Temperaturemin
-25 °C
Package Style
GRID ARRAY, FINE PITCH
REACH Uyumluluk Kodu
unknown
Package Equivalence Code
BGA48,6X8,30
Package Description
FBGA, BGA48,6X8,30
Standby Currentmax
0.000002 A
Package Shape
RECTANGULAR
Supply Currentmax
0.025 mA
Package Body Material
PLASTIC/EPOXY
Memory Width
16
Number Of Terminals
48
Yüzey Montaj
YES
Part Life Cycle Code
Obsolete
HTS Kodu
8542.32.00.71
Organization
2MX16
Operating Temperaturemax
85 °C
Memory Density
33554432 bit
Jesd30 Code
R-PBGA-B48
Temperature Grade
OTHER
Supply Voltagenom Vsup
3 V

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