SST34HF1641C-70-4E-L1P

Specifications

Uzunluk

10 mm

Part Package Code

BGA

Ihs Manufacturer

SILICON STORAGE TECHNOLOGY INC

Tepe Reflow Sıcaklığı (°C)

240

Genişlik

8 mm

Supply Voltagemin Vsup

2.7 V

Part Life Cycle Code

Obsolete

Fonksiyon Sayısı

1

Tepe Reflow Süresi (maks. sn)

10

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Package Description

LFBGA,

Package Shape

RECTANGULAR

Package Body Material

PLASTIC/EPOXY

Memory Density

16777216 bit

ECCN Kodu

EAR99

Number Of Words

1048576 words

Operating Mode

ASYNCHRONOUS

Number Of Words Code

1000000

REACH Uyumluluk Kodu

unknown

Yüzey Montaj

YES

Package Code

LFBGA

Terminal Pozisyonu

BOTTOM

HTS Kodu

8542.32.00.71

Supply Voltagenom Vsup

3 V

Number Of Terminals

56

Memory Ic Type

MEMORY CIRCUIT

Supply Voltagemax Vsup

3.3 V

Memory Width

16

Pin Sayısı

56

Terminal Adımı

0.8 mm

Jesd30 Code

R-PBGA-B56

Seated Heightmax

1.4 mm

Additional Feature

SRAM IS ORGANIZED AS 256K X 16 / 512K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8

Rohs Code

No

Operating Temperaturemax

85 °C

Qualification Status

Not Qualified

Organization

1MX16

Operating Temperaturemin

-20 °C

Terminal Formu

BALL

Temperature Grade

OTHER