SST32HF3242C-70-4E-LFS

Specifications

Uzunluk

10 mm

Part Package Code

BGA

Genişlik

8 mm

Supply Voltagemin Vsup

2.7 V

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SILICON STORAGE TECHNOLOGY INC

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Package Description

LFBGA,

Package Shape

RECTANGULAR

Fonksiyon Sayısı

1

Tepe Reflow Süresi (maks. sn)

NOT SPECIFIED

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Memory Density

33554432 bit

Package Body Material

PLASTIC/EPOXY

Number Of Words

2097152 words

ECCN Kodu

EAR99

Number Of Words Code

2000000

Operating Mode

ASYNCHRONOUS

Yüzey Montaj

YES

REACH Uyumluluk Kodu

unknown

Package Code

LFBGA

HTS Kodu

8542.32.00.71

Terminal Pozisyonu

BOTTOM

Supply Voltagenom Vsup

3 V

Number Of Terminals

63

Memory Ic Type

MEMORY CIRCUIT

Terminal Adımı

0.8 mm

Jesd30 Code

R-PBGA-B63

Supply Voltagemax Vsup

3.3 V

Memory Width

16

Pin Sayısı

63

Seated Heightmax

1.4 mm

Rohs Code

No

Additional Feature

SRAM IS ORGANIZED AS 256K X 16

Operating Temperaturemax

85 °C

Organization

2MX16

Qualification Status

Not Qualified

Temperature Grade

OTHER

Operating Temperaturemin

-20 °C

Terminal Formu

BALL