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C3 ChipZentronix
330

Serpac

330

Perforated Prototype Boards

RoHS: Compliant

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Priced by quantity and lead time.

Technical summary (PDF)

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RoHS

Compliant

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Specifications

Contact Materials
Glass
Parça Durumu
Obsolete
Plating
Non-Plated Through Hole (NPTH)
Boyut / Ölçü
4.00Lx2.88W 101.6mmx73.2mm
Hole Diameter
0.038 (0.97mm)
Nem Hassasiyeti (MSL)
Not Applicable
Proto Board Type
Breadboard, Prepunched Insulating
Genişlik
73.152mm
Material
Glass
Montaj
Horizontal
Pitch
0.100 2.54mm
Board Thickness
0.062 1.57mm 1/16
Uzunluk
101.6mm
RoHS Durumu
RoHS Compliant

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